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Manufacturer: Vi Technology Model: Vi 5K 3D Type of Machine: AOI Year of Manufacture: 2020 Technical Specifications: - Configuration: Single - Max PCB Size: 533mm x 325mm - Field of View: 61.1 x 44.9 mm - Camera: 8 Mpix, 12 bits CCD, telecentric lens Find more here - .ucymachines/ Contact us at - sales@ucymachines
usava
Manufacturer: Vi Technology Model: Vi 5K 3D Type of Machine: AOI Year of Manufacture: 2015 Technical Specifications: - Configuration: Single - Max PCB Size: 533mm x 325mm - Field of View: 61.1 x 44.9 mm - Camera: 8 Mpix, 12 bits CCD, telecentric lens Find more here - .ucymachines/ Contact us at - sales@ucymachines
usava
Manufacturer: Vi Technology Model: Vi 5K 3D Type of Machine: AOI Year of Manufacture: 2011 Technical Specifications: - Configuration: Single - Max PCB Size: 533mm x 325mm - Field of View: 61.1 x 44.9 mm - Camera: 8 Mpix, 12 bits CCD, telecentric lens Find more here - .ucymachines/ Contact us at - sales@ucymachines
usava
Manufacturer: Vi Technology Year of Manufacture: 2017 Model: Vi 8K 3D Type of Machine: AOI System Technical Specifications: - Configuration: Dual 8K SPECTRO 3D - System Type: Automated Optical Inspection System - Dual Lane Single Inline (basic configuration) - 3D Sensor: New integrated 3D sensor developed in partnership with German company - Resolution: approximately 20 micron x 20 micron x 0.7 micron (xyz) - Compatibility: K-series algorithm chain, 5K/7K/9K HW platform - 3D Image Production: High resolution 3D image for review operator classification - Gantry: High speed gantry, precision XY gantry, high-speed linear motors with closed loop high resolution linear encoders - Conveyor: Automatic conveyor width adjustment for boards up to 533 mm x 610 mm (21 in x 24 in) - PCB Size Dual Lane Mode: 2 x 432 x 325 mm - PCB Size Single Lane Mode: 432 x 600 mm - Maximum PCB Weight ...
usava
Manufacturer: Vi Technology Year of Manufacture: 2021 Model: Vi 8K 3D Type of Machine: AOI System Technical Specifications: - Configuration: Dual 8K SPECTRO 3D - System Type: Automated Optical Inspection System - Dual Lane Single Inline (basic configuration) - 3D Sensor: New integrated 3D sensor developed in partnership with German company - Resolution: approximately 20 micron x 20 micron x 0.7 micron (xyz) - Compatibility: K-series algorithm chain, 5K/7K/9K HW platform - 3D Image Production: High resolution 3D image for review operator classification - Gantry: High speed gantry, precision XY gantry, high-speed linear motors with closed loop high resolution linear encoders - Conveyor: Automatic conveyor width adjustment for boards up to 533 mm x 610 mm (21 in x 24 in) - PCB Size Dual Lane Mode: 2 x 432 x 325 mm - PCB Size Single Lane Mode: 432 x 600 mm - Maximum PCB Weight ...
Manufacturer: Vi Technology Year of Manufacture: 2020 Model: PI PRIMO Type of Machine: Solder Paste Inspection (SPI) System Technical Specifications: - Configuration: Single - 3D Vision: 80 Mpixel 3D system (32 cameras, 8 projectors) - Triangulation: Distortion free 3D triangulation system - Lighting: High power RGB LED lighting for 3D color image - Resolution: 15 micron - Max Paste Height Measurement: 400 micron - Max PCB Size: 533 x 533 mm - Min PCB Size: 50 x 50 mm - PCB Thickness Range: 0.1 to 5 mm - Edge Clearance: 3 mm - Max PCB Warp: plus or minus 5 mm - Calibration: Embedded photometric and geometric calibration tools - Standard Conveyor Length: 1000 mm (800 mm option) Find more here - .ucymachines/ Contact us at - sales@ucymachines
usava
Manufacturer: Vi Technology Year of Manufacture: 2017 Model: PI PRIMO Type of Machine: Solder Paste Inspection (SPI) System Technical Specifications: - Configuration: Single - 3D Vision: 80 Mpixel 3D system (32 cameras, 8 projectors) - Triangulation: Distortion free 3D triangulation system - Lighting: High power RGB LED lighting for 3D color image - Resolution: 15 micron - Max Paste Height Measurement: 400 micron - Max PCB Size: 533 x 533 mm - Min PCB Size: 50 x 50 mm - PCB Thickness Range: 0.1 to 5 mm - Edge Clearance: 3 mm - Max PCB Warp: plus or minus 5 mm - Calibration: Embedded photometric and geometric calibration tools - Standard Conveyor Length: 1000 mm (800 mm option) Find more here - .ucymachines/ Contact us at - sales@ucymachines
usava
Manufacturer: Vi Technology Year of Manufacture: 2021 Model: PI PRIMO Type of Machine: Solder Paste Inspection (SPI) System Technical Specifications: - Configuration: Single - 3D Vision: 80 Mpixel 3D system (32 cameras, 8 projectors) - Triangulation: Distortion free 3D triangulation system - Lighting: High power RGB LED lighting for 3D color image - Resolution: 15 micron - Max Paste Height Measurement: 400 micron - Max PCB Size: 533 x 533 mm - Min PCB Size: 50 x 50 mm - PCB Thickness Range: 0.1 to 5 mm - Edge Clearance: 3 mm - Max PCB Warp: plus or minus 5 mm - Calibration: Embedded photometric and geometric calibration tools - Standard Conveyor Length: 1000 mm (800 mm option) Find more here - .ucymachines/ Contact us at - sales@ucymachines