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VISCOM)

 
Categoria: 2100 partes elétricas
18.05.2026
Número do item: 168776681
Ano de construção: 2011

usava


Manufacturer: VISCOM Model: S3088 III Year of Manufacture: 2011 Weight: 750kg Last annual maintenance by Viscom: June 23, 2025 With a loading/unloading machine: - Manufacturer: ASYS - Type: AES 03DK - Year of manufacture: 05/11 - Weight: 335kg Find more here - / Contact us at -

Categoria: 2100 partes elétricas
18.05.2026
Número do item: 168729210
Ano de construção: 2014

usava


Based on the nameplate you provided and the technical data for the S3088 SPI (Solder Paste Inspection) variant, here are the key specifications for your machine: PCs replaced in 2024 to new ones Core Inspection Capabilities The S3088 SPI is a specialized high-performance system designed to detect printing defects immediately after the stencil printer. - Inspection Scope: Analyzes solder paste deposits for volume, height, form, area, displacement (X/Y offset), and smearing. - Component Compatibility: Capable of inspecting demanding assemblies with CSPs, micro BGAs, and pad sizes down to 01005. - 3D Technology: Uses a fringe projection process for precise 3D height and volume measurement. - Inspection Speed: Up to 80 cm²/s (depending on resolution settings). --------------------------------------------------------------- Technical Specifications (from your Nameplate & Records) Featu ...

Categoria: 2100 partes elétricas
18.05.2026
Número do item: 168729211
Ano de construção: 2014

usava


The Viscom S3088 ultra gold is a high-performance 3D Automated Optical Inspection (AOI) system designed for high-volume electronics manufacturing that requires maximum throughput and precision. PCs replaced in 2024 to new ones Top Performance Specs - Inspection Speed: Up to 65 cm²/s, making it ideal for the highest throughput demands. - 3D Sensor Technology: Powered by the XMplus high-performance camera module. - Camera Configuration: Features up to 9 cameras (including orthogonal and angled views) for shadow-free 3D inspection. - Image Field Size: $50\text{ mm} \times 50\text{ mm}$. - Resolution: High-resolution 3D analysis down to 10 µm (orthogonal) and 0.5 µm (Z-axis). --------------------------------------------------------------- Key Technical Capabilities - Component Range: Reliably inspects the latest miniaturized generations, including 03015 components. - Defect Detection ...

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